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学术报告通知《Development of High-Performance Heat Sink Composite Material》
作者: [] 日期: [2020年11月18日 14:20] 访问量: []

报告题目Development of High-Performance Heat Sink Composite Material

报告时间20201125日(周三)14301600

报告地点:机械馆J3报告厅

报告形式:远程视频

报告人:佐佐木 Sasaki Gen

报告人简介:

   佐佐木元毕业于日本东北大学,现在是日本广岛大学大学院工学研究科教授,博士生导师。主要的研究方向:有关高功能高性能金属、陶瓷及金属基复合材料的物理现象的阐明和开发的研究。专业领域包括机械材料(金属基复合材料、陶瓷基复合材料、铝/镁等轻金属材料)、电子显微镜和X射线衍射的表征。目前研究的方向为高功能高性能金属、陶瓷及金属基复合材料的物理现象的阐明和开发。基于纳米亚微米尺寸级别下组织观察,组织定量化以及利用计算机模拟的建模来指导加工工艺,从而实现对材料组织的调控。最新的研究方向为赋予方向性的高热传导金属基复合材料的开发和热传导特性的理论评价。在Materials Science and Engineering A, Journal of Materials Processing Technology, Journal of Alloys and Compounds等国际期刊,日本金属学会志,粉体和粉末冶金,轻金属等日本国内期刊,以及国际会议上发表论文123篇。曾任日本粉体粉末冶金协会参事,日本铸造工程学会编辑委员会同行评审会员;现任日本复合材料学会理事,轻金属奖学会选考委员会选考委员,日本机械学会机械材料生产加工部扩大指导委员会委员,广岛市产业技术支援顾问。并获得2016年日本机械工程师学会机械材料和材料加工分会性能奖。

报告内容简介:

With the rapid development of integration and miniaturization in electronic devices and circuitry, heat dissipation has emerged as a severe issue in recent years. It is well known poor heat dissipation will significantly despair the performance of electronic devices because of heat accumulation induced high temperature. Therefore, how to enhance the heat dissipation has become a hot research topic. All electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure. There are several techniques for releasing heat including various styles of heat sinks, thermoelectric coolers, forced air systems and fans, heat pipes, and others, among which heat sinks are the most effective way to transfer heat. Heat conduction efficiency of heat sinks highly depends on the interfacial thermal resistance and intrinsic thermal conductivity of heat sink materials. Accordingly, we are focusing on developing different novel metal matrix composites (MMCs) with high performance as heat sink materials, since the microstructure of MMCs can be tailored in order to achieve high thermal conductivity as well as high performance. In this report, we will introduce some novel MMCs synthesized in our laboratory from the viewpoint of interfacial design, fraction and size tailoring of reinforcement, and computational simulation to further understand the mechanism of thermal enhancement of MMCs for the application of heat sink materials.

      *本报告由燕山大学引才引智国际合作培育项目资助。

机械工程学院

20201118


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